Effects of substrate metallization of solder/under-bump metallization interfacial reactions in flip-chip packages during multiple reflow cycles

✍ Scribed by F. Zhang; M. Li; C. C. Chum; Z. C. Shao

• Book ID: 107453046
• Publisher: Springer US
• Year: 2003
• Tongue: English
• Weight: 487 KB
• Volume: 32
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-003-0182-3