✦ LIBER ✦
Design of Solder Joint Structure for Flip Chip Package with an Optimized Shear Test Method
✍ Scribed by Jong-Woong Kim; Seung-Boo Jung
- Book ID
- 107453889
- Publisher
- Springer US
- Year
- 2007
- Tongue
- English
- Weight
- 453 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0361-5235
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