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Electroplating of Cu(Ag) thin films for interconnect applications

✍ Scribed by S. Strehle; S. Menzel; J.W. Bartha; K. Wetzig

Publisher: Elsevier Science
Year: 2010
Tongue: English
Weight: 525 KB
Volume: 87
Category: Article
ISSN: 0167-9317
DOI: 10.1016/j.mee.2009.07.010

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