Barrier and seed repair performance of thin RuTa films for Cu interconnects

✍ Scribed by H. Volders; L. Carbonell; N. Heylen; K. Kellens; C. Zhao; K. Marrant; G. Faelens; T. Conard; B. Parmentier; J. Steenbergen; M. Van de Peer; C.J. Wilson; E. Sleeckx; G.P. Beyer; Zs. Tőkei; V. Gravey; K. Shah; A. Cockburn

• Publisher: Elsevier Science
• Year: 2011
• Tongue: English
• Weight: 802 KB
• Volume: 88
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2010.09.003