Development of thermally stable NiAg interconnections for application to resistive films

✍ Scribed by P.K. Khannaa; S.K. Bhatnagar; G. Dalke; D. Brunner; W. Gust

• Publisher: Elsevier Science
• Year: 1995
• Tongue: English
• Weight: 351 KB
• Volume: 33
• Category: Article
• ISSN: 0921-5107
• DOI: 10.1016/0921-5107(94)01204-0