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Electroless Co(Mo,P) films for Cu interconnect application

✍ Scribed by Y Shacham-Diamand; A Zylberman; N Petrov; Y Sverdlov


Publisher
Elsevier Science
Year
2002
Tongue
English
Weight
197 KB
Volume
64
Category
Article
ISSN
0167-9317

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Evaluation of electroless deposited Co(W
✍ A. Kohn; M. Eizenberg; Y. Shacham-Diamand; B. Israel; Y. Sverdlov πŸ“‚ Article πŸ“… 2001 πŸ› Elsevier Science 🌐 English βš– 231 KB

Electroless deposited Co(W,P) thin films were evaluated as diffusion barriers for copper metallization. Capacitance versus time measurements of MOS structures as well as SIMS depth profiles indicate that 30-nm-thick films can function as effective barriers against copper diffusion after thermal trea