✦ LIBER ✦
Solder bump interconnected, multiple chip, thick film hybrid for 40-character alphanumeric LCD application : Jim Marshall and Francé Rodé. Solid St. Technol. p. 87 (January 1979)
- Publisher
- Elsevier Science
- Year
- 1979
- Tongue
- English
- Weight
- 130 KB
- Volume
- 19
- Category
- Article
- ISSN
- 0026-2714
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