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Electromigration failure modes in damascene copper interconnects

✍ Scribed by L. Arnaud; R. Gonella; G. Tartavel; J. Torrès; C. Gounelle; Y. Gobil; Y. Morand


Book ID
108362378
Publisher
Elsevier Science
Year
1998
Tongue
English
Weight
479 KB
Volume
38
Category
Article
ISSN
0026-2714

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Correlation of electromigration lifetime
✍ L.M. Gignac; C.-K. Hu; E.G. Liniger 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 667 KB

The electromigration cumulative percent lifetime probability of dual Damascene Cu / SiLK interconnects was fitted using three, individual lognormal functions where the functional populations were grouped by void growth location determined from focused ion beam failure analysis of all 54 of the stres