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Electromigration failure in ultra-fine copper interconnects

✍ Scribed by Nancy L. Michael; Choong-Un Kim; Paul Gillespie; Rod Augur

Book ID: 107452957
Publisher: Springer US
Year: 2003
Tongue: English
Weight: 203 KB
Volume: 32
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-003-0080-8

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