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Mechanism of electromigration failure in submicron Cu interconnects

✍ Scribed by Nancy L. Michael; Choong-Un Kim; Qing-Tang Jiang; R. A. Augur; P. Gillespie

Book ID
107452734
Publisher
Springer US
Year
2002
Tongue
English
Weight
491 KB
Volume
31
Category
Article
ISSN
0361-5235

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