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Reservoir effect on electromigration mechanisms in dual-damascene Cu interconnect structures

✍ Scribed by A.V. Vairagar; S.G. Mhaisalkar; M.A. Meyer; E. Zschech; Ahila Krishnamoorthy


Book ID
108207516
Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
224 KB
Volume
82
Category
Article
ISSN
0167-9317

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Correlation of electromigration lifetime
✍ L.M. Gignac; C.-K. Hu; E.G. Liniger πŸ“‚ Article πŸ“… 2003 πŸ› Elsevier Science 🌐 English βš– 667 KB

The electromigration cumulative percent lifetime probability of dual Damascene Cu / SiLK interconnects was fitted using three, individual lognormal functions where the functional populations were grouped by void growth location determined from focused ion beam failure analysis of all 54 of the stres