Correlation of electromigration lifetime
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L.M. Gignac; C.-K. Hu; E.G. Liniger
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Article
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2003
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Elsevier Science
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English
β 667 KB
The electromigration cumulative percent lifetime probability of dual Damascene Cu / SiLK interconnects was fitted using three, individual lognormal functions where the functional populations were grouped by void growth location determined from focused ion beam failure analysis of all 54 of the stres