✦ LIBER ✦
A Model for Understanding Electromigration-Induced Void Evolution in Dual-Inlaid Cu Interconnect Structures
✍ Scribed by D.J. Pete; J.B. Helonde; A.V. Vairagar; S.G. Mhaisalkar
- Book ID
- 107457426
- Publisher
- Springer US
- Year
- 2011
- Tongue
- English
- Weight
- 286 KB
- Volume
- 41
- Category
- Article
- ISSN
- 0361-5235
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