✦ LIBER ✦
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures
✍ Scribed by Arijit Roy; Cher Ming Tan; Rakesh Kumar; Xian Tong Chen
- Book ID
- 108210578
- Publisher
- Elsevier Science
- Year
- 2005
- Tongue
- English
- Weight
- 785 KB
- Volume
- 45
- Category
- Article
- ISSN
- 0026-2714
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