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Electromigration Cu mass flow in Cu interconnections

✍ Scribed by C.-K. Hu; D. Canaperi; S.T. Chen; L.M. Gignac; S. Kaldor; M. Krishnan; S.G. Malhotra; E. Liniger; J.R. Lloyd; D.L. Rath; D. Restaino; R. Rosenberg; J. Rubino; S.-C. Seo; A. Simon; S. Smith; W.-T. Tseng

Book ID: 108289178
Publisher: Elsevier Science
Year: 2006
Tongue: English
Weight: 246 KB
Volume: 504
Category: Article
ISSN: 0040-6090
DOI: 10.1016/j.tsf.2005.09.161

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