✦ LIBER ✦

Electromigration resistance of TiWN/Cu/TiWN interconnections

✍ Scribed by Tetsuo Fukada; Takeshi Mori; Yoshihiko Toyoda; Makiko Hasegawa; Keisuke Namba; Kazunao Ogata

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Electromigration resistance of copper in

✍ D. Save; F. Braud; J. Torres; F. Binder; C. Müller; J.O. Weidner; W. Hasse 📂 Article 📅 1997 🏛 Elsevier Science 🌐 English ⚖ 483 KB

Mechanism of electromigration failure in

✍ Nancy L. Michael; Choong-Un Kim; Qing-Tang Jiang; R. A. Augur; P. Gillespie 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 491 KB

The effect of polyimide passivation on t

✍ Jiann-Shan Jiang; Bi-Shiou Chiou 📂 Article 📅 2001 🏛 Springer US 🌐 English ⚖ 535 KB

Effect of low k dielectrics on electromi

✍ Paul S. Ho; Ki-Don Lee; Sean Yoon; Xia Lu; Ennis T. Ogawa 📂 Article 📅 2004 🏛 Elsevier Science 🌐 English ⚖ 543 KB

Correlation of electromigration defects

✍ Horst Wendrock; Kabir Mirpuri; Siegfried Menzel; Günther Schindler; Klaus Wetzig 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 231 KB

A new investigation of copper's role in

✍ X.-Y Liu; C.-L Liu; L.J Borucki 📂 Article 📅 1999 🏛 Elsevier Science 🌐 English ⚖ 136 KB