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Correlation of electromigration defects in small damascene Cu interconnects with their microstructure

✍ Scribed by Horst Wendrock; Kabir Mirpuri; Siegfried Menzel; Günther Schindler; Klaus Wetzig

Book ID
104050402
Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
231 KB
Volume
82
Category
Article
ISSN
0167-9317

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Correlation of electromigration lifetime distribution to failure mode in dual Damascene Cu/SiLK interconnects
✍ L.M. Gignac; C.-K. Hu; E.G. Liniger 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 667 KB

The electromigration cumulative percent lifetime probability of dual Damascene Cu / SiLK interconnects was fitted using three, individual lognormal functions where the functional populations were grouped by void growth location determined from focused ion beam failure analysis of all 54 of the stres