✦ LIBER ✦
A new investigation of copper's role in enhancing Al–Cu interconnect electromigration resistance from an atomistic view
✍ Scribed by X.-Y Liu; C.-L Liu; L.J Borucki
- Book ID
- 108492335
- Publisher
- Elsevier Science
- Year
- 1999
- Tongue
- English
- Weight
- 136 KB
- Volume
- 47
- Category
- Article
- ISSN
- 1359-6454
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