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Electromigration in width transition copper interconnect

✍ Scribed by Arijit Roy; Yuejin Hou; Cher Ming Tan

Book ID: 108210823
Publisher: Elsevier Science
Year: 2009
Tongue: English
Weight: 510 KB
Volume: 49
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2009.06.038

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