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Electromigration Performance of Multi-level Damascene Copper Interconnects

✍ Scribed by S. Yokogawa; N. Okada; Y. Kakuhara; H. Takizawa

Book ID
108361861
Publisher
Elsevier Science
Year
2001
Tongue
English
Weight
767 KB
Volume
41
Category
Article
ISSN
0026-2714

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The electromigration cumulative percent lifetime probability of dual Damascene Cu / SiLK interconnects was fitted using three, individual lognormal functions where the functional populations were grouped by void growth location determined from focused ion beam failure analysis of all 54 of the stres