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Annealing textures of copper damascene interconnects for ultra-large-scale integration

✍ Scribed by Hyo Jong Lee; Heung Nam Han; Dong Nyung Lee

Book ID: 107453426
Publisher: Springer US
Year: 2005
Tongue: English
Weight: 395 KB
Volume: 34
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-005-0156-8

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