✦ LIBER ✦
Process design of Cu(Sn) alloy deposition for highly reliable ultra large-scale integration interconnects
✍ Scribed by Hoon Kim; Toshihiko Koseki; Takayuki Ohba; Tomohiro Ohta; Yasuhiko Kojima; Hiroshi Sato; Yukihiro Shimogaki
- Book ID
- 108287894
- Publisher
- Elsevier Science
- Year
- 2005
- Tongue
- English
- Weight
- 431 KB
- Volume
- 491
- Category
- Article
- ISSN
- 0040-6090
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