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Copper-based metallization and interconnects for ultra-large-scale integration applications

✍ Scribed by Terry L. Alford; Li Jian; James W. Mayer; Wang Shi-Qing

Publisher: Elsevier Science
Year: 1995
Tongue: English
Weight: 159 KB
Volume: 262
Category: Article
ISSN: 0040-6090
DOI: 10.1016/0040-6090(95)06624-1

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