✦ LIBER ✦
“Seedless” electrochemical deposition of copper on physical vapor deposition-W2N liner materials for ultra large scale integration (ULSI) devices
✍ Scribed by Michael J. Shaw; Stephan Grunow; David J. Duquette
- Book ID
- 107452685
- Publisher
- Springer US
- Year
- 2001
- Tongue
- English
- Weight
- 593 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0361-5235
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