Effects of Silver and Antimony Content in Lead-Free High-Temperature Solders of Bi-Ag and Bi-Sb on Copper Substrate

✍ Scribed by Nahavandi, M.; Hanim, M. A. Azmah; Ismarrubie, Z. N.; Hajalilou, A.; Rohaizuan, R.; Fadzli, M. Z. Shahrul

• Book ID: 125373844
• Publisher: Springer US
• Year: 2013
• Tongue: English
• Weight: 702 KB
• Volume: 43
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-013-2873-8