✦ LIBER ✦

Wettability and strength of In–Bi–Sn lead-free solder alloy on copper substrate

✍ Scribed by Ervina Efzan Mhd Noor; Nurulakmal Mohd Sharif; Cheong Kuan Yew; Tadashi Ariga; Ahmad Badri Ismail; Zuhailawati Hussain

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Improvement of wettability and tensile p

✍ L Wang; D.Q Yu; J Zhao; M.L Huang 📂 Article 📅 2002 🏛 Elsevier Science 🌐 English ⚖ 154 KB

Wetting behaviour and reactivity of lead

✍ F. Gnecco; E. Ricci; S. Amore; D. Giuranno; G. Borzone; G. Zanicchi; R. Novakovi 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 694 KB

The adhesion strength of A lead-free sol

✍ Shan-Pu Yu; Min-Hsiung Hon; Moo-Chin Wang 📂 Article 📅 2000 🏛 Springer US 🌐 English ⚖ 685 KB

Effect of temperature and substrate surf

✍ Satyanarayan, K. N. Prabhu 📂 Article 📅 2012 🏛 Springer US 🌐 English ⚖ 931 KB

Microstructure and tensile behavior of S

✍ M.J. Esfandyarpour; R. Mahmudi 📂 Article 📅 2011 🏛 Elsevier Science 🌐 English ⚖ 876 KB

Microstructure and adhesion strength of

✍ Tao-Chih Chang; Shih-Min Chou; Min-Hsiung Hon; Moo-Chin Wang 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 760 KB