✦ LIBER ✦

Wetting behaviour and reactivity of lead free Au–In–Sn and Bi–In–Sn alloys on copper substrates

✍ Scribed by F. Gnecco; E. Ricci; S. Amore; D. Giuranno; G. Borzone; G. Zanicchi; R. Novakovic

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Wetting behaviour of lead-free Sn-based

✍ S. Amore; E. Ricci; G. Borzone; R. Novakovic 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 465 KB

A Comparative Study of Reactive Wetting

✍ Hongqin Wang; Hui Zhao; Dusan P. Sekulic; Yiyu Qian 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 536 KB

Interfacial Reactions of Sn-58Bi and Sn-

✍ Yee-Wen Yen; Da-Wei Liaw; Kuen-Da Chen; Hao Chen 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 585 KB

Microstructure and adhesion strength of

✍ Tao-Chih Chang; Shih-Min Chou; Min-Hsiung Hon; Moo-Chin Wang 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 760 KB

Solderability testing of Sn-Ag-XCu Pb-fr

✍ Edwin P. Lopez; Paul T. Vianco; Jerome A. Rejent 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 956 KB

Alloying behavior of Au-In and Au-Sn fil

✍ L. Buene; T. Finstad; K. Rimstad; O. Lönsjö; T. Olsen 📂 Article 📅 1976 🏛 Elsevier Science 🌐 English ⚖ 338 KB