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A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates

✍ Scribed by Hongqin Wang; Hui Zhao; Dusan P. Sekulic; Yiyu Qian

Publisher: Springer US
Year: 2008
Tongue: English
Weight: 536 KB
Volume: 37
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-008-0502-8

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