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Effect of isothermal aging on room temperature impression creep of lead free Sn–9Zn and Sn–8Zn–3Bi solders

✍ Scribed by Mahmudi, R.; Geranmayeh, A. R.; Noori, H.; Khanbareh, H.; Jahangiri, N.


Book ID
127223895
Publisher
Institute of Materials, Minerals and Mining
Year
2010
Tongue
English
Weight
340 KB
Volume
26
Category
Article
ISSN
0267-0836

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