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Interfacial reactions between Sn–8Zn–3Bi–xNi lead-free solders and Cu substrate during isothermal aging

✍ Scribed by Lijuan Liu; Wei Zhou; Baoling Li; Ping Wu

Book ID: 113783674
Publisher: Elsevier Science
Year: 2010
Tongue: English
Weight: 795 KB
Volume: 123
Category: Article
ISSN: 0254-0584
DOI: 10.1016/j.matchemphys.2010.05.028

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