✦ LIBER ✦

Comments on “Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints”

✍ Scribed by A. Paul; T. Laurila

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Microstructural evolution of Sn–9Zn–3Bi

✍ L.L. Duan; D.Q. Yu; S.Q. Han; H.T. Ma; L. Wang 📂 Article 📅 2004 🏛 Elsevier Science 🌐 English ⚖ 549 KB

Effects of Current Stressing on Shear Pr

✍ X.J. Wang; Q.L. Zeng; Q.S. Zhu; Z.G. Wang; J.K. Shang 📂 Article 📅 2010 🏛 Allerton Press Inc 🌐 English ⚖ 967 KB

Effects of Thermal Aging on Microstructu

✍ Chen Wei; Yongchang Liu; Zhiming Gao; Jingbo Wan; Changsheng Ma 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 492 KB

Effect of indium addition on the microst

✍ Ming-jie Dong, Zhi-ming Gao, Yong-chang Liu, Xun Wang, Li-ming Yu 📂 Article 📅 2012 🏛 Springer-Verlag 🌐 English ⚖ 487 KB

Effect of cooling rate on microstructure

✍ J. G. Maveety; P. Liu; J. Vijayen; F. Hua; E. A. Sanchez 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 846 KB

Effect of small Sn–3.5Ag–0.5Cu additions

✍ Asit Kumar Gain; Y.C. Chan; Ahmed Sharif; Winco K.C. Yung 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 1011 KB