Microstructural evolution of Sn–9Zn–3Bi solder/Cu joint during long-term aging at 170 °C

✍ Scribed by L.L. Duan; D.Q. Yu; S.Q. Han; H.T. Ma; L. Wang

• Book ID: 116597871
• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 549 KB
• Volume: 381
• Category: Article
• ISSN: 0925-8388
• DOI: 10.1016/j.jallcom.2004.03.124