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Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder

✍ Scribed by Chen Wei; Yongchang Liu; Zhiming Gao; Jingbo Wan; Changsheng Ma


Publisher
Springer US
Year
2008
Tongue
English
Weight
492 KB
Volume
38
Category
Article
ISSN
0361-5235

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