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Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder

✍ Scribed by Jie Zhao; Lin Qi; Xiu-min Wang; Lai Wang


Book ID
116597570
Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
421 KB
Volume
375
Category
Article
ISSN
0925-8388

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