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Effect of slurry injection position on material removal in chemical mechanical planarization

✍ Scribed by Tongqing Wang, Dewen Zhao, Yongyong He, Xinchun Lu

Book ID
120967215
Publisher
Springer
Year
2013
Tongue
English
Weight
406 KB
Volume
67
Category
Article
ISSN
0268-3768

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The ability to predict material removal rates in chemical mechanical planarization (CMP) is an essential ingredient for low cost, high quality IC chips. Recently, models that address the slurry particles have been proposed. We address three such models. The first two differ only in how the number of