Effect of ramp rates during rapid thermal annealing of ion implanted boron for formation of ultra-shallow junctions
โ Scribed by Aditya Agarwal; Hans-J. Gossmann; Anthony T. Fiory
- Book ID
- 107457923
- Publisher
- Springer US
- Year
- 1999
- Tongue
- English
- Weight
- 194 KB
- Volume
- 28
- Category
- Article
- ISSN
- 0361-5235
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๐ SIMILAR VOLUMES
Ultra-shallow p-type junction formation has been investigated using 10508C spike anneals in lamp-based and hotwalled rapid thermal processing (RTP) systems. A spike anneal may be characterized by a fast ramp-up to temperature with only a fraction of a second soak-time at temperature. The eects of th
This work combines plasma doping implantation (PLAD) with laser annealing using excimer laser, for the formation of ultra-shallow junctions. For that purpose, high dose BF 3 was implanted in n-type silicon wafers using PLAD. The as implanted material was investigated by high resolution TEM, measured