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Effect of 9 wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads

✍ Scribed by M.N. Islam; Y.C. Chan; A. Sharif; M.J. Rizvi

No coin nor oath required. For personal study only.

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Effect of 9&#xa0;wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads