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The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads

✍ Scribed by Hsiu-Jen Lin; Tung-Han Chuang

No coin nor oath required. For personal study only.

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The effect of 0.5&#xa0;wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads