Depressing effect of 0.2wt.%Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

✍ Scribed by Feng-Jiang Wang; Feng Gao; Xin Ma; Yi-Yu Qian

• Publisher: Springer US
• Year: 2006
• Tongue: English
• Weight: 280 KB
• Volume: 35
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-006-0163-4