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Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

✍ Scribed by M.J. Rizvi; Y.C. Chan; C. Bailey; H. Lu; M.N. Islam

No coin nor oath required. For personal study only.

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Effect of adding 1&#xa0;wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging