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Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: Part I: Wetting behavior on Cu and Ni substrates

✍ Scribed by M.J. Rizvi; C. Bailey; Y.C. Chan; H. Lu

No coin nor oath required. For personal study only.

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Effect of adding 0.3&#xa0;wt% Ni into the Sn–0.7&#xa0;wt%Cu solder: Part I: Wetting behavior on Cu and Ni substrates