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Effect of Zn addition on the formation and growth of intermetallic compound at Sn–3.5 wt% Ag/Cu interface

✍ Scribed by Chun Yu; Hao Lu; Shiming Li

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

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✍ Tao-Chih Chang; Moo-Chin Wang; Min-Hsiung Hon 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 848 KB

Effect of Zn addition on the formation and growth of intermetallic compound at Sn–3.5&#xa0;wt% Ag/Cu interface