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Diffusion barrier properties of AlMoNbSiTaTiVZr high-entropy alloy layer between copper and silicon

✍ Scribed by Ming-Hung Tsai; Jien-Wei Yeh; Jon-Yiew Gan

Book ID: 108289863
Publisher: Elsevier Science
Year: 2008
Tongue: English
Weight: 251 KB
Volume: 516
Category: Article
ISSN: 0040-6090
DOI: 10.1016/j.tsf.2007.07.109

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