✦ LIBER ✦

Evaluation of Ti–Si–N as a diffusion barrier between copper and silicon

✍ Scribed by Jin-Tae No; Jun-Hwan O; Chongmu Lee

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Ti-Si-N diffusion barriers between silic

✍ Reid, J.S.; Sun, X.; Kolawa, E.; Nicolet, M.-A. 📂 Article 📅 1994 🏛 IEEE 🌐 English ⚖ 303 KB

Tantalum and niobium as a diffusion barr

✍ Si-Yeoul Jang; Sung-Man Lee; Hong-Koo Baik 📂 Article 📅 1996 🏛 Springer US 🌐 English ⚖ 661 KB

Ta-Si-N as a diffusion barrier between C

✍ Chongmu Lee; Young-Hoon Shin 📂 Article 📅 1998 🏛 Elsevier Science 🌐 English ⚖ 377 KB

Electroless CoWP as a Diffusion Barrier

✍ T.K. Tsai; S.S. Wu; W.L. Liu; S.H. Hsieh; W.J. Chen 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 375 KB

ITO as a Diffusion Barrier Between Si an

✍ Liu, C. M.; Liu, W. L.; Chen, W. J.; Hsieh, S. H.; Tsai, T. K.; Yang, L. C. 📂 Article 📅 2005 🏛 The Electrochemical Society 🌐 English ⚖ 956 KB

Amorphous NiNW film as a diffusion bar

✍ M.F. Zhu; F.C.T. So; M.-A. Nicolet 📂 Article 📅 1985 🏛 Elsevier Science 🌐 English ⚖ 378 KB