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Electroless CoWP as a Diffusion Barrier between Electroless Copper and Silicon

✍ Scribed by T.K. Tsai; S.S. Wu; W.L. Liu; S.H. Hsieh; W.J. Chen

Book ID: 107454963
Publisher: Springer US
Year: 2007
Tongue: English
Weight: 375 KB
Volume: 36
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-007-0223-4

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