Pre-annealing effect of electroless Ni−B deposit as a diffusion barrier for electroplated Cu electrodes

✍ Scribed by Jae Woong Choi; Gil Ho Hwang; Won Kyu Han; Sung Goon Kang

• Book ID: 105696724
• Publisher: TechnoPress
• Year: 2006
• Tongue: English
• Weight: 838 KB
• Volume: 12
• Category: Article
• ISSN: 1598-9623
• DOI: 10.1007/bf03027527