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Synthesis and characterization of electroless deposited Co–W–P thin films as diffusion barrier layer

✍ Scribed by A. Abdel Aal; H. Barakat; Z. Abdel Hamid


Book ID
108278413
Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
805 KB
Volume
202
Category
Article
ISSN
0257-8972

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Evaluation of electroless deposited Co(W
✍ A. Kohn; M. Eizenberg; Y. Shacham-Diamand; B. Israel; Y. Sverdlov 📂 Article 📅 2001 🏛 Elsevier Science 🌐 English ⚖ 231 KB

Electroless deposited Co(W,P) thin films were evaluated as diffusion barriers for copper metallization. Capacitance versus time measurements of MOS structures as well as SIMS depth profiles indicate that 30-nm-thick films can function as effective barriers against copper diffusion after thermal trea