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Characterization of electroless deposited Co(W,P) thin films for encapsulation of copper metallization

✍ Scribed by A. Kohn; M. Eizenberg; Y. Shacham-Diamand; Y. Sverdlov

Book ID: 108466971
Publisher: Elsevier Science
Year: 2001
Tongue: English
Weight: 345 KB
Volume: 302
Category: Article
ISSN: 0921-5093
DOI: 10.1016/s0921-5093(00)01348-4

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