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Electrical resistivity of thin electroless Ag–W films for metallization

✍ Scribed by E.E. Glickman; V. Bogush; A. Inberg; Y. Shacham-Diamand; N. Croitoru

Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
344 KB
Volume
70
Category
Article
ISSN
0167-9317

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✦ Synopsis

It is shown that optimization of the electroless deposition and the use of vacuum annealing yield dramatic decrease in the resistivity and its scatter in 100-and 50-nm silver-tungsten (Ag-W) films. Physical processes, which control the resistivity drop during low-temperature annealing and the residue resistivity in the annealed films are discussed.

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