A comparative molecular dynamics study of copper trench fill properties between Ta and Ti barrier layers

✍ Scribed by J.Y. Yang; R.T. Hong; M.J. Huang

• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 320 KB
• Volume: 8
• Category: Article
• ISSN: 1369-8001
• DOI: 10.1016/j.mssp.2006.02.001